How Do Microvias and Buried Vias Enhance Signal Integrity in Next Generation HDI PCB Architectures?
Introduction As data rates in telecommunications, computing, and high-speed networking cross into the multi-gigabit domain, traditional circuit board interconnected elements become major signal liabilities. Standard through-hole vias that travel completely through a multi-layer board act as unintended transmission line stubs, causing severe signal reflections and attenuation at high frequencies. To prevent this destructive signal degradation, …